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Hi-Rel Electronics Components

Image Sensor Sockets

Andon has developed the largest line of Image Sensor Sockets in the industry. We have sockets for Atmel, Dalsa, E2V, Fairchild, Hamamatsu, Kodak, Marconi, Micron, Motorola, National, NEC, Peripheral Imaging, Phillips, Site, Sony, TI, and Toshiba.

Image Sensor sockets provide higher reliability because the sockets can be soldered to the motherboard in large quantities. Later, as required, the sensors can be plugged-in or unplugged and upgraded easily.

 Downloade datasheet

Battery Sockets

Andon offers a growing family of sockets that permit quick and reliable battery replacement.

The battery socket can be production soldered to the PCB, avoiding the need to hand solder batteries in place. Use of a battery socket also eliminates desoldering, blistering or delaminating of the PCB when the battery needs replacement.

Our battery sockets feature molded clips that prevent the battery from being dislodged by shock and vibration. Andon battery sockets provide quick and reliable solutions for critical applications such as CMOS memory back-up, and primary power for portable or remote equipment.

Downloade datasheet

Battery Sockets

For many electronic applications, fuse replacement is common. But fuse replacement can involve risk of damage to the PCB loaded with expensive components, especially while being soldered or desoldered. Andon fuse sockets offer a quick and easy answer.

They are available in a variety of configurations for thru-hole or SMD, including 2-pin SIPS, as well as high temperature SIP and TO-5 sockets.

Downloade datasheet

PGA Sockets and Adapters

Andon Pin Grid Array Sockets and PGA Adapters are perfect for high pin count microprocessors.

Andon offers the widest selection of standard footprints, from 5×5 to 26×26, as well as custom designed PGA Sockets.

Andon PGA Sockets offer a choice of insertion and extraction forces, including Andon’s exclusive 1 ounce ultra low force contact.

Downloade datasheet

BGA Sockets and Adapters

Andon’s BGA Sockets and Adapters provide an ideal method for mounting ball grid array devices onto a PCB. The device is soldered to the adapter, greatly simplifying solder verification and testing.

The device/adapter assembly then plugs into the BGA socket, which is permanently soldered to the PCB. The BGA adapter is offered with either flat or countersunk heads. Our BGA sockets can be surface or thru-hole mounted.

Downloade datasheet

LCC Sockets

LCC Image Sensors are packaged with up to 100 castellations (contacts). The ceramic substrate packaging presents new challenges for RoHS high temperature soldering.

Historically, Image Sensors are soldered directly on the printed circuit board (PCB). LCC Image Sensors require longer soldering times for RoHS high temperature solders. The ceramic substrate “expands” while the solder joint is “fixed” and cracks.

Downloade datasheet

DIP Sockets

Andon has many versions of closed frame DIP Sockets, utilizing our famous High-Rel multi-finger contact.

The closed frame DIP sockets include varieties with and without mounting holes, surface mount, shrink DIP, crystal and relay, zig zag, board to board and raised interconnects.

Downloade datasheet

SIP Sockets

Utilizing our famous High-Rel multi-finger contact, Andon offers many versions of SIP sockets.

The large selection of SIP Sockets include adapters, solid and snap-off packages, board to board, pin headers and pin receptacles.

  • 301 SNAP-OFF SINGLE IN-LINE PACKAGE
  • 302 SOLID SIP
  • 303 SNAP-OFF HEADS FLUSH
  • 305 SNAP-OFF SIP COMPONENT ADAPTER
  • 306 SOLID SIP COMPONENT ADAPTER
  • 307 SNAP-OFF SIP HEADER / BOARD TO BOARD
  • 308 SOLID SIP HEADER / BOARD TO BOARD
  • 351 TWIN STRIP
  • 355 TWIN STRIP COMPONENT ADAPTER
  • 405 SIP (LAMINATE WAFER)
  • 411 POLYIMIDE SIP

Downloade datasheet

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